Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory ...
Lam Research Corporation is a $17 billion wafer-fabrication equipment maker. They are simulating and designing next generation computer memory. Its products are used primarily in front-end wafer ...
Universal memory promises to replace both RAM and flash storage in computers with a better, faster and more energy-efficient alternative — and researchers have just moved this one step closer to ...
New Multiplexed Registered Clock Driver, Multiplexed Data Buffer and PMIC Enable Next-Generation MRDIMM Speeds up to 12,800 Mega Transfers per Second for AI and High-Performance Compute Applications ...
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