Detecting defects within MEMS (microelectromechanical systems) is not an easy task. The components inside these structures are a varied mix of electrical circuits, mechanical devices, and sensors. The ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these ...

In the last few years, semiconductor circuit features have shrunk to sub-100 nanometer (nm) dimensions, while the size of the thin silicon wafers that these circuits are constructed on has grown from ...

MILPITAS, Calif., July 10, 2018 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring ...

Now, WaferWeight allows fabs to track wafer mass quickly, accurately, and economically – concurrently with macro defect inspection. Our EAGLEview can do defect inspection and wafer weighing both at ...

In the coming years, the production of silicon wafers is expected to grow thanks to increased demand for semiconductors. This is especially true in the industries of consumer electronics and ...